Module Engineer | Trilingual Module Engineer (m/f/d)
European Semiconductor Manufacturing Company
Job Summary
The Module Engineer will be instrumental in establishing a cutting-edge semiconductor fab in Dresden, Germany, as part of a joint venture between leading technology companies. This role offers the unique opportunity to actively shape the future of semiconductor manufacturing in Europe. Responsibilities will vary based on background and operational needs, potentially spanning process integration, process engineering, or equipment engineering. Day-to-day tasks could involve optimizing integration flows, defining and improving fabrication processes, or installing and maintaining manufacturing equipment. The ideal candidate will possess strong analytical and problem-solving skills, be a self-starter, and thrive in a dynamic, multicultural startup environment. This position is particularly attractive due to its early-stage involvement in a major European semiconductor initiative, offering significant career growth and access to world-class expertise and resources from TSMC, including extensive training in Taiwan.
Required Skills
Education
Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Chemistry, Mechanical Engineering, Physics, or a related field
Experience
- Exposure to multicultural teams or international projects
- Experience in a high-volume semiconductor fab or R&D facility (plus)
Languages
Additional
- Applicants must be legally eligible to work in Germany. Willingness to travel to Taiwan for a minimum of 12 months for on-job training. Onboarding starts October 1st, 2025. Location: Dresden, Germany.
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