Technical Staff - Lithography Wafer Level Packaging | Technische*r Mitarbeiter*in - Lithographie Wafer Level Packaging

Job Summary

Join a dynamic team at the Fraunhofer Institute for Reliability and Microintegration IZM, a leading research institution in microelectronic systems. This role focuses on the development and implementation of lithography and polymer processes for Wafer-Level-Packaging. You will be instrumental in optimizing process parameters for micro and nanostructures, supporting research projects, maintaining lithography equipment, and developing new lithography techniques to enhance precision and efficiency. The ideal candidate will have a background in microtechnology or process engineering, with hands-on experience in lithography processes, including the operation of spin coater, mask aligner, and/or LDI systems. This position offers a unique opportunity to contribute to groundbreaking projects in a modern research environment, with excellent professional development opportunities and a supportive work-life balance.