Senior Researcher/Engineer, Advanced Packaging and Heterogeneous Integration | Physiker/in

Job Summary

This role seeks a highly motivated researcher/engineer to join an interdisciplinary team, focusing on cutting-edge heterogeneous integration and advanced packaging technologies. The position operates at the intersection of microelectronics, photonics, and RF systems, driving innovative developments from initial concept through fabrication and characterization. Key responsibilities include designing, fabricating, and evaluating advanced packaging solutions such as RF/Si/photonic interposers and co-packaged optics, alongside performing microfabrication and backend processing within a cleanroom environment. Candidates must hold a Ph.D. in Physics or a related engineering field and possess 5+ years of relevant professional experience, including in-depth knowledge of advanced packaging processes like chiplets and FOWLP. The position offers the opportunity to take responsibility for project management, contribute to scientific publications, and work with state-of-the-art facilities in a challenging research environment in Europe.