Physicist | Physiker/in

Job Summary

Join our wafer-level packaging team as a Physicist to drive cutting-edge wafer bonding technologies. You will be responsible for developing and optimizing advanced wafer bonding processes for next-generation 3D and heterogeneous integration. This includes operating and owning bonding equipment, developing permanent and temporary bonding techniques, and performing pre-bond surface preparation. You will also characterize bonded interfaces, manage process control, and contribute to R&D projects. The ideal candidate holds a university degree in a related field, possesses at least five years of hands-on cleanroom and semiconductor fabrication experience, and has a proven track record in wafer bonding process development. Fluency in English is required. This role offers state-of-the-art facilities and diverse research challenges in the heart of Europe.