Plasma R&D Process Engineer | Physiker/in

Silicon Austria Labs GmbH SAL Villach

St. Magdalen, Kärnten, Österreich

Published Apr 7, 2026

Full-time

Permanent

Job Summary

As a Plasma R&D Process Engineer specializing in Dry Etch and PECVD, you will play a pivotal role in a state-of-the-art semiconductor fabrication environment. Your daily responsibilities include developing and optimizing plasma etch and deposition processes, maintaining equipment uptime, and establishing stable process baselines through Statistical Process Control (SPC). You will act as a technical owner for plasma tools, ensuring high reproducibility across diverse research and development flows while collaborating with cross-functional teams to ensure full fabrication compatibility. This position is ideal for a proactive professional who enjoys troubleshooting and continuous improvement in a research-driven setting. The role is uniquely attractive due to its location in the heart of Europe, offering a modern work environment with extensive benefits including flexible home office options (up to 40% in Austria), comprehensive health programs, and a strong commitment to work-life balance and family compatibility.

Required Skills

Education

Master's degree (or Bachelor's degree with equivalent relevant experience) in Materials Science, Physics, Electrical Engineering, or a related field.

Experience

Minimum 3 years of experience as a plasma process engineer in an industrial or applied research semiconductor FAB (5+ years preferred)
Hands-on experience with plasma etch systems such as ICP, RIE, and PECVD
Proven experience in establishing robust and transferable etch processes
Professional experience with methodologies including SPC, Problem Solving, and Lean
Experience in a research-driven environment supporting multiple stakeholders

Languages

Not specified

Additional

Willingness to relocate to Villach, Austria; Ability to work in a cleanroom environment; Availability for occasional travel within the EU (< 25%).