Engineer for Non-Destructive Analysis Methods | Ingenieur für zerstörungsfreie Analyseverfahren (w/m/div.)

Job Summary

This role involves establishing and managing non-destructive analysis methods, specifically X-ray computed tomography and ultrasonic microscopy, within a semiconductor manufacturing environment. The engineer will be responsible for the full lifecycle of these analytical processes, from equipment evaluation and procurement to independent analysis of semiconductor samples. Key responsibilities include ensuring high availability and stable operation of analytical equipment, coordinating maintenance, and delivering quality-assured reports to internal departments. The position requires a proactive individual who can serve as a technical point of contact, advising on analytical possibilities and presenting findings to interdisciplinary teams, contributing to production material release, process control, and technology development.