Senior 3D IC Solutions Engineer - Package Design Lead - EDA | 3D IC Solutions Engineer - Package Design Engineer - EDA

Job Summary

This senior-level role focuses on leading the development of comprehensive, end-to-end workflow solutions for advanced 2.5D and 3D System-in-Package (SiP) designs within Siemens EDA. The successful candidate will drive the creation and validation of physical design planning, layout, and verification workflows for 3D ICs, including package floor planning, interposer/substrate planning, and Logical Equivalence Checking (LEC). This involves seamlessly integrating Siemens' EDA and MCAD tools to facilitate architectural planning, physical design/verification, and multi-die electrical, thermal, and mechanical stress analysis. The role requires advanced experience in package physical design, verification, and a strong working knowledge of advanced packaging EDA tools and scripting languages like Python and Tcl. The position also includes providing crucial technical support and guidance to sales and marketing teams, making it a critical interface between cutting-edge technology development and customer engagement.