R&D Process Engineer (Thin Film Deposition) | Physiker/in

Silicon Austria Labs GmbH SAL Villach

Villach, Kärnten, Österreich
Published Nov 14, 2025
Full-time
Permanent

Job Summary

This role seeks a motivated R&D Process Engineer specializing in Thin Film deposition to join the SAL MicroFab team. The engineer will be responsible for developing, monitoring, and optimizing thin film deposition processes, primarily sputtering, to support critical R&D and prototype fabrication activities. Key responsibilities include maintaining tool health through SPC monitoring and preventive maintenance coordination, leading tool upgrades, and ensuring compliance with FAB standards. The ideal candidate holds a Master's degree in Physics, Materials Science, or Electrical Engineering, and possesses a minimum of three years of industrial semiconductor FAB experience, with a strong background in PVD/sputtering and process control methodologies like SPC and Lean. This position offers challenging tasks with significant decision-making scope in a state-of-the-art facility in Austria, fostering continuous professional growth and supporting work-life balance.

Required Skills

Education

Master's degree in Materials Science, Physics, Electrical Engineering, or related field (Bachelor's with equivalent experience considered)

Experience

  • Minimum 3 years (5+ preferred) as a deposition process engineer in an industrial semiconductor FAB
  • Hands-on experience with sputter deposition tools (PVD) and thin-film process optimization
  • Proven experience applying process control methodologies, including SPC, CIP, Lean, and Problem Solving
  • Experience working effectively in a research-driven environment supporting multiple stakeholders

Languages

Not specified

Additional

  • Willingness to relocate to Villach, Austria