Plasma R&D Process Engineer | Physiker/in

Job Summary

This role seeks a motivated Plasma R&D Process Engineer focusing on Dry Etch and PECVD to join the SAL MicroFab team. The engineer will be responsible for developing, optimizing, and sustaining critical plasma etch and deposition processes to support diverse R&D flows. Key daily activities include establishing stable, repeatable process baselines using Statistical Process Control (SPC), ensuring high tool uptime through ownership and maintenance, and defining detailed process documentation. The position requires leading troubleshooting, root cause analysis, and continuous improvement initiatives, collaborating closely with the wider process engineering team to ensure compatibility across the full fabrication flow. Candidates must hold a Master’s degree in Physics, Materials Science, or Electrical Engineering, coupled with a minimum of three years of hands-on experience as a plasma process engineer in an industrial or applied research semiconductor FAB. The ideal candidate possesses proven expertise in plasma etch systems (ICP, RIE, PECVD), process control, and equipment maintenance principles, demonstrating strong analytical and collaborative skills in a research-driven environment.