Research Scientist in System Packaging | Wissenschaftliche*r Mitarbeiter*in im Bereich System Packaging

Job Summary

This role involves joining an innovative research team focused on the technological advancement and system integration of Micro-Electro-Mechanical Systems (MEMS). The Research Scientist will actively participate in application-oriented and scientific projects, driving the development of complex joining processes like wafer- and chip-level bonding, and contributing to material deposition technologies. A core responsibility includes managing publicly funded research projects and industrial contracts, ensuring successful technology transfer to industrial environments. The ideal candidate holds a university degree in Electrical Engineering, Microsystems Technology, or a related field, possesses strong knowledge of microelectronic processes, and is proficient in both German and English (B2 level or higher). This position offers the opportunity to utilize highly specialized lab equipment, collaborate across interdisciplinary teams of engineers and scientists, and shape the future of microsystems technology within the Fraunhofer network.