Technical Assistant - Deposition of Dielectric Layers & Metals | Technischer Mitarbeiter (all genders) - Abscheidung von dielektrischen Schichten & Metallen
Fraunhofer-Gesellschaft e.V. Zentrale München
Job Summary
This role involves the hands-on fabrication of integrated electronic circuits and optical components using semiconductor materials. The primary focus will be on the deposition of dielectric and metallic layers onto processed wafers, coupled with the maintenance and supervision of the necessary equipment. Additionally, the position includes tasks within electrochemical technology, such as the deposition of metal bumps for the heterogeneous integration of chips or wafers. Ideal candidates will possess a relevant technical education and professional experience in semiconductor technology, particularly in thin-film deposition and process control. This is an opportunity to contribute to cutting-edge microelectronics, optoelectronics, and quantum technologies within a leading applied research organization.
Required Skills
Education
Completed training as a Chemical or Physical-Technical Assistant, Microtechnologist, or in a comparable field, ideally supplemented by further training as a Technician.
Experience
- Professional experience in semiconductor technology
- Experience in thin-film deposition
- Experience in structuring
- Experience in physical-chemical measurement technology
- Experience in process control and documentation
Languages
Additional
- Willingness to occasionally work until 6:00 PM.
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