Process Engineer for Plasma Etching Processes | Prozessingenieur für Plasmaätzprozesse (all genders)

Job Summary

This role involves developing and optimizing plasma etching processes for nanostructures on 300mm wafers, a critical function within the Fraunhofer-Institut für Photonische Mikrosysteme IPMS. The successful candidate will be responsible for planning and executing experiments in dry etching, operating tools in a cleanroom environment, and ensuring the maintenance and documentation of etching process equipment. A key aspect of the job includes applying advanced wafer analysis methods and interpreting results to drive process innovation. This position is ideal for someone with a background in physics, chemistry, materials science, electrical engineering, or process engineering, who possesses 3-5 years of experience in vacuum and plasma processes, particularly plasma etching. The role offers an opportunity to work in an international, interdisciplinary team, contributing to cutting-edge technology solutions for various industries.