Engineer for Electrical and Optical Interconnect Technology | Ingenieur für elektrische und optische Aufbau- u. Verbindungstechnik (m/w/d)
Institut für Mikroelektronik Stuttgart IMS CHIPS
Job Summary
This role offers a unique opportunity to shape the future of microelectronic circuits and systems by joining a spin-off from the University of Stuttgart, focusing on high-tech solutions in areas like IT, environmental technologies, energy, and mobility. Initially, the engineer will undergo thorough training within the New Semiconductor Devices department before transitioning to the start-up environment. The core mission involves independently developing a new, potentially high-market-impact technology within a small team. Day-to-day responsibilities include developing Single-Photon Detectors (SPADs), integrating semiconductor and electronic components into market-ready systems, and establishing electronic and photonic connections. The position also involves FPGA and microcontroller development. Candidates should possess a Master's degree in natural sciences or engineering, strong electronics knowledge, and experience with optical and electro-optical components, coupled with an analytical, conceptual, and highly self-sufficient working style.
Required Skills
Education
Master's or Diploma degree in Natural Sciences or Engineering
Experience
- Experience in the development of optical and electronic sensor systems
- Experience in developing manufacturing-ready process and integration chains
- Initial knowledge of 3D-printed free-form optics
- Professional experience in microcontroller programming
Languages
Additional
- High interest in new challenges within a high-tech start-up environment; Strong interest in continuous learning and scientific work with a practical focus.