Engineer for Electrical and Optical Packaging and Interconnection Technology | Ingenieur für elektrische und optische Aufbau- u. Verbindungstechnik (m/w/d)
Institut für Mikroelektronik
Job Summary
This role involves pioneering the development of new, market-ready microelectronic systems within a high-tech startup environment, spun out from the University of Stuttgart. Initially, you will undergo intensive training in the New Semiconductor Devices department before transitioning into an Integration Expert role within the startup. Your daily tasks will focus on developing Single-Photon Detectors (SPADs), integrating semiconductor and electronic components into complete modules, and establishing electronic and photonic interconnections. You will also be involved in FPGA and microcontroller development. This position is ideal for an ambitious engineer with a background in natural sciences or engineering, possessing expertise in optical/electro-optical components and a strong desire to contribute independently to cutting-edge technology in fields like information technology, life science, and energy.
Required Skills
Education
Master's or Diploma degree in Natural Sciences or Engineering
Experience
- Experience in the setup of optical and electronic sensor systems
- Experience in developing production-ready process and integration chains
- Initial knowledge (Know-how) related to 3D printed free-form optics
- In-depth electronics knowledge and experience in microcontroller programming
- First professional experience in optical and electro-optical components (for recent graduates)
Languages
Additional
- Temporary contract duration; Requirement to transition employment from the initial research institute (IMS) to the startup (IHT spin-off) after the first year of training; High degree of self-reliance and team capability required; Strong interest in new challenges in the high-tech environment.