Process Engineer / Document Developer - Microsystems Technology & Packaging | Prozessingenieur/ Document Developer - Mikrosystemtechnik & Packaging (m/w/d)
Bundesdruckerei Gruppe GmbH
Job Summary
This role is for a Process Engineer and Document Developer specializing in Microsystems Technology and Packaging. The successful candidate will join a team in Berlin, focusing on the development, stabilization, and optimization of processes for inlay development. Key responsibilities include introducing and supporting new chip assembly lines for inlay manufacturing, overseeing product integration, production support, and ramp-up in both inlay and card production. The position also involves conducting fault analyses, developing corrective measures for error prevention, process stabilization, and yield optimization. The ideal candidate will have a background in microsystems technology, electrical engineering, precision engineering, or semiconductor technology, coupled with professional experience in advanced packaging and microelectronic component assembly.
Required Skills
Education
Degree in Microsystems Technology, Electrical Engineering, Precision Engineering, Semiconductor Technology, or comparable qualification (e.g., Microtechnologist)
Experience
- Professional experience in a relevant area (e.g., process engineering, microsystems technology)
- Knowledge in Advanced Packaging
- In-depth knowledge of assembly and interconnection technology for microelectronic components, especially Flip-Chip technology
- Practical experience in the development and industrialization of processes and technologies
- Ideally, familiarity with screen printing of electronic circuits
Languages
Additional
- Not specified
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