Assembly and Interconnection Technology Engineer – Project Management | Ingenieur für Aufbau und Verbindungstechnik – Projektbearbeitung (w/m/d)

Job Summary

This role seeks an Assembly and Interconnection Technology Engineer to manage specialized projects focusing on complex backend requirements, housing, and packaging for acoustic surface wave (SAW) components. Day-to-day responsibilities involve conceptualizing and evaluating cutting-edge technologies, such as Wafer Level Packaging (WLP), and successfully introducing these innovations into the manufacturing process while ensuring stringent quality standards. The position requires active international collaboration. Candidates must hold a university degree in Assembly and Interconnection Technology, Microsystems Technology, or a related field, ideally complemented by practical professional experience. This is an attractive opportunity within a high-tech Dresden-based company offering a permanent contract, flexible working hours (flextime), flat hierarchies, significant creative freedom, and the chance to work within an innovative, international team environment.