Scientist Thin Film Technology (PE-CVD / PE-ALD) | Scientist Thin Film Technology (PE-CVD / PE-ALD)

Evatec AG

Trübbach, SG, Switzerland
Published Dec 2, 2025
Full-time
Permanent

Job Summary

This mission-critical role focuses on driving innovation in thin-film deposition systems and processes, specifically utilizing Plasma Enhanced Chemical Vapor Deposition (PECVD) and Plasma Enhanced Atomic Layer Deposition (PEALD) technologies for semiconductor applications. Key day-to-day activities include developing design proposals for next-generation systems, conducting complex simulations related to fluid dynamics, thermodynamics, and plasma properties, and planning/executing experiments for hardware and process optimization. Candidates must hold a technical university degree (Master or PhD) in relevant fields like Physics or Material Science, coupled with at least two years of professional experience in vacuum and thin-film technology. This is an attractive opportunity to shape the future of cutting-edge technologies—contributing to autonomous driving and 5G networks—within a team that values innovation, collaboration, and scientific expertise, requiring fluent English communication skills.

Required Skills

Education

Technical university degree (Master or PhD) in Physics, Chemical Engineering, Material Science, or a related field.

Experience

  • At least 2 years of professional experience in vacuum and thin-film technology
  • Ideally, experience with PECVD/PEALD for semiconductor applications
  • Foundational knowledge in programming and simulation

Languages

German (Intermediate)English (Fluent)

Additional

  • Strong analytical thinking and problem-solving competence; Ability to generate Intellectual Property (IP), publish articles, and represent the company at conferences and clients.